1 MA4PH611 melf pin diode advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. v1 absolute maximum ratings t amb = +25c (unless otherwise noted) 1,2 parameter absolute maximum d.c. reverse voltage 1000v operating chip junction temperature -55c to +175c storage temperature -55c to +200c installation temperature +280c for 10 seconds notes 1. operation of this devic e above any one of these parameters may cause permanent damage. 2. please refer to application note m538 for surface mounting instructions. package style 1091 dot denotes cathode description the chip used in the ma 4ph611 is manufactured using a unique, cermachi p, passivation process which provides for a hard glass encapsulation that protects and hermetically s eals the active area of the chip. this packaged, cermachip, pin diode is ideally suited for use in applications where high rf and dc voltages are present. the chip is enclosed in a rugged, ceramic, metal electrode leadless faced (melf), surface mount package that is full face bonded to refractory metal plugs on both the anode and ca thode. the result is a low loss pin diode with low thermal resistance due to its symmetrical thermal paths. melf pin diodes are designed specific ally for high volume tape and reel assembly. their user friendly design provides for extremely easy, automatic, pick and place, indexing and assembly. all solderable surfaces are tin plated and ar e compatible with all industry standard reflow and vapor phase solder processes. features ? high power handling ? low loss / low distortion ? leadless low inductance melf package ? surface mountable ? rohs compliant applications the MA4PH611 is well suited for use in low loss, low distortion, uhf and vhf high power switching circuits. i
2 MA4PH611 melf pin diode advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. v1 electrical specificat ions @ +25 c 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 ct ? vs. ? v ? @ ? 1mhz pf volts 0 1 10 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 ohms rs ? vs. ? i ? @ ? 100mhz ma
3 MA4PH611 melf pin diode advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. v1 electrical specificat ions @ +25 c 1 10 100 1000 0 4 8 12162024283236 rp ? vs. ? v@? 500mhz k ? ohms 1 10 100 1000 5 55 104 154 203 253 302 352 401 451 500 rp ? @ ? 0v ? vs. ? freq mhz rp volts?
4 MA4PH611 melf pin diode advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. v1 circuit pad layout dimension package style 1091 inches mm a 0.150 3.81 b 0.050 1.27 c 0.100 2.54 b b c a a a b c solderable surf aces cathode dim. inches mm min. max. min. max. a 0.138 0.155 3.51 3.94 b 0.180 0.200 4.57 5.08 c 0.008 0.030 0.203 0.762 package dimensions ordering information package style quantity 7? reel bulk devices 1091t 500 n/a for further tape and reel information refer to application note m513 on the macom website p d 1 p d 2 thermal power thermal power resistance dissipation resistance dissipation c/w w c/w w infinite infinite in air in air heatsink heatsink max. max. max. max. 15 10 42 3.5 v f t l i r c t r s r p forward lifetime reverse total series parallel voltage leakage capacitance resistance resistance v dc s na pf w kw condition conditions condition conditions conditions conditions i f = 250ma i f = 10 ma v r = 1000v f = 1 mhz f = 100 mhz f = 100 mhz i r = 6 ma v r = 50 v i f = 100 ma v r = 0 v max. min. max. typ. max. typ. max. min. 1.1 5 1000 0.95 1.1 0.35 0.45 25 1. de-rate linearly by ?77 mw/c to 0w @ +175 c junction temperature. 2. de-rate linearly by ?25 mw/c to 0w @ +175 c junction temperature notes:
5 MA4PH611 melf pin diode advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. v1 handling procedures the following precautions should be observed to avoid damaging these devices. cleanliness and storage melf devices should be handled and stored in a clean environment. the metalized ends of the device are tin plated for greater solderability and any continuous exposure to high humidity (>80%) for extended periods of time may cause the surface to oxidize. caution should be taken when storing devices for extended intervals. esd these devices are susceptible to esd and are rated class 1c. general handling device can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment. rohs the MA4PH611 is fully rohs compliant meaning it contains less than the maximum allowable concentration of 0.1%, by weight, in homogenous materials for lead, hex chrome, mercury, pbb, pbde, and 0.01% for cadmium. mounting techniques solder attach typical wave soldering or reflow techniques may be used to mount melf pack ages to circuit boards. alloys such as sn63/pb37 or any rohs compliant solder may be used. for more information visit the macom website and refer to application note m538. assembly recommendations ? devices may be soldered using standard sn63/pb37 or any rohs compliant solder. leads are bright tin plated to a minimum thickness of 50 m to ensure an optimum connection. ? for recommended sn/pb and rohs soldering time/te mperature profiles. s ee application note m538 on the macom website. note : click links below to vi ew datasheets of other melf and packaged pin diodes. packaged_pin_diodes and/or ma4p melf & hipax series
|
